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l o w s u p p l y c u r r e n t , 5 0 m w s t e r e o c a p - f r e e h e a d p h o n e d r i v e r c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . f e a t u r e s t h e a p a 2 1 8 0 i s a s t e r e o , f i x e d g a i n , s i n g l e s u p p l y , a n d c a p - f r e e h e a d p h o n e d r i v e r , w h i c h i s a v a i l a b l e i n a w l c s p 1 . 6 x 1 . 6 - 1 2 a n d t d f n 3 x 3 - 1 2 p a c k a g e s . t h e a p a 2 1 8 0 i s g r o u n d - r e f e r e n c e o u t p u t a n d d o n ? t n e e d t h e o u t p u t c a p a c i t o r s f o r d c b l o c k i n g . t h e a d v a n t a g e s o f e l i m i n a t i n g t h e o u t p u t c a p a c i t o r a r e s a v i n g t h e c o s t , e l i m i - n a t i n g c o m p o n e n t h e i g h t , a n d i m p r o v i n g t h e l o w f r e q u e n c y r e s p o n s e . t h e i n t e r n a l f i x e d g a i n s e t t i n g ( - 1 . 5 v / v ) c a n m i n i m i z e t h e e x t e r n a l c o m p o n e n t c o u n t s a n d s a v e t h e p c b s p a c e . h i g h p s r r p r o v i d e s i n c r e a s e d i m m u n i t y t o n o i s e a n d r f r e c t i f i c a t i o n . t h e a p a 2 1 8 0 i s c a p a b l e o f d r i v i n g 5 0 m w a t 3 . 6 v i n t o 1 6 w l o a d a n d p r o v i d e s t h e r m a l p r o t e c t i o n . a p p l i c a t i o n s h a n d s e t s p d a s p o r t a b l e m u l t i m e d i a d e v i c e s n o t e b o o k s g e n e r a l d e s c r i p t i o n o p e r a t i n g v o l t a g e : 2 . 3 v ~ 5 . 5 v s u p p l y c u r r e n t - i d d = 1 m a a t v d d = 3 . 6 v l o w s h u t d o w n c u r r e n t - i d d = 5 m a a t v d d = 3 . 6 v g r o u n d r e f e r e n c e o u t p u t - n o o u t p u t c a p a c i t o r r e q u i r e d ( f o r d c b l o c k i n g ) - s a v e t h e p c b s p a c e - r e d u c e t h e b o m c o s t s - i m p r o v e t h e l o w f r e q u e n c y r e s p o n s e o u t p u t p o w e r 5 0 m w / c h i n t o 1 6 w a t v d d = 3 . 6 v high psrr: 80db at 217hz fast start-up time: 4ms integrate the de-pop circuitry t h e r m a l p r o t e c t i o n s u r f a c e - m o u n t p a c k a g i n g w l c s p 1 . 6 x 1 . 6 - 1 2 t d f n 3 x 3 - 1 2 lead free and green devices available (rohs compliant) s i m p l i f i e d a p p l i c a t i o n c i r c u i t apa2180 rout rin sdn lin lout stereo input signal shutdown control stereo headphone
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 2 p i n c o n f i g u r a t i o n tdfn 3 x 3 - 12 ( top view ) 10 cpn 11 cvss 12 vss sdn 3 rout 2 lout 1 vdd 6 rin 5 lin 4 7 gnd 8 cpp 9 pgnd a 8 0 x pin a 1 date code marking lout ( c 1 ) rout ( c 2 ) cvss ( a 1 ) gnd ( b 3 ) vss ( b 1 ) lin ( c 3 ) rin ( c 4 ) vdd ( b 4 ) sdn ( b 2 ) cpn ( a 2 ) pgnd ( a 3 ) cpp ( a 4 ) wlcsp 1 . 6 x 1 . 6 - 12 ( top view )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 3 a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v pgnd_gnd pgnd to gnd voltage - 0.3 to 0.3 v dd supply voltage ( vdd to gnd and pgnd ) - 0.3 to 5.5 v sd n input voltage (sdn to gnd ) gnd - 0.3 to v dd +0.3 v ss vss to gnd and pgnd voltage - 5.5 to 0.3 v out rout and lout t o gnd voltage v ss - 0.3 to v dd +0.3 v cpp cpp to pgnd voltage pgnd - 0.3 to v dd +0.3 v cpn cpn to pgnd voltage pv ss - 0.3 to pgnd+0.3 v t j maximum junction temperature 150 t stg storage temperature range - 65 to +150 t s dr maximum soldering temperature ran ge , 10 seconds 260 o c p d power dissipation internally limited w o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . note1: stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. apa 2180 package code ha : wlcsp 1 . 6 x 1 . 6 - 12 qb : tdfn 3 x 3 - 12 temperature range i : - 40 to 85 o c handling code tr : tape & reel assembly material g : halogen and lead free device handling code temperature range package code apa 2180 ha : a 80 x x - date code assembly material apa 2180 qb : apa 2180 xxxxx x - date code
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 4 t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja thermal resistance - junction to ambient ( note 2) wlcsp1.6x1.6 - 12 tdfn3x3 - 12 160 50 o c/w n o t e 2 : p l e a s e r e f e r t o ? t h e r m a l p a d c o n s i d e r a t i o n ? . 2 l a y e r e d 5 i n 2 p r i n t e d c i r c u i t b o a r d s w i t h 2 o z t r a c e a n d c o p p e r t h r o u g h s e v e r a l t h e r m a l v i a s . t h e t h e r m a l p a d i s s o l d e r e d o n t h e p c b . r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s symbol parameter range unit v dd supply voltage 2.3 ~ 5.5 v ih high level threshold voltage sdn 1.0 ~ v dd v il low level threshold voltage sdn 0 ~ 0.35 v t a operating ambient temperature range - 40 ~ 85 t j operating ambient temperature range - 40 ~ 125 o c r l headphone resistance 16 ~ 100k w apa2180 symbol parameter test condition s min. typ. max. unit i dd v dd supply current - 1 2 ma i sd v dd shutdown current v sdn = 0v - 5 10 i i input current sdn - 0. 1 - m a charge pump f osc switching frequency 400 500 600 khz r eq equiva lent resistance - 15 18 w drivers a v internal voltage gain no load - 1.55 - 1.5 - 1.45 v/v ? a v gain matching - 1 2 % r i input resistance 12 14 16 r f feedback resistance 17 21 25 k w v sr slew rate - 2.5 - v/ m s v os output offset voltage v dd =2.3v to 5.5v, r l = 16 w - 8 - 8 mv v n output noise - 27 - m vrms psrr power supply rejection ratio v dd =2.3v to 5.5v , v rr =200mvrms f in = 217 hz f in = 1k hz f in = 20k hz - - 80 - 80 - 40 - 60 - 60 - 35 db c l maximum capacitive load - 400 - pf t start - up start - up time - 4 - ms v esd esd protection outr, outl - 8 - kv e l e c t r i c a l c h a r a c t e r i s t i c s v d d = 3 . 6 v , v g n d = v p g n d = 0 v , v s d n = v d d , c c p f = c c p o = 1 m f , c i = 1 m f , t a = 2 5 o c ( u n l e s s o t h e r w i s e n o t e d ) .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 5 apa2180 symbol parameter test condition s min. typ. max. unit drivers (cont.) thd +n =1% , f in =1khz r l = 16 w r l = 32 w 45 50 60 - p o output power (stereo, in phase) t hd +n =1 0 % , f in =1khz r l = 16 w r l = 32 w - 70 80 - mw thd+n total harmonic distortio n p l us noise p o = 20mw, r l = 32 w f in = 20 hz f in =1 k hz f in = 20k hz - 0.03 0.03 0.20 - % crosstalk channel separation p o = 20mw, r l = 16 w , f in = 20 hz f in =1 k hz f in = 20k hz 75 85 85 70 - s/n signal to noise ratio v dd =5v, p o = 140mw, r l = 32 w , w ith a - weight ing filter - 95 - db e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) v d d = 3 . 6 v , v g n d = v p g n d = 0 v , v s d n = v d d , c c p f = c c p o = 1 m f , c i = 1 m f , t a = 2 5 o c ( u n l e s s o t h e r w i s e n o t e d ) .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 6 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s 0 200m 50m 100m 150m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =4.2v r l =16 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1 0 125m 25m 50m 75m 100m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =3.6v r l =16 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1 0 75m 15m 30m 45m 60m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =2.8v r l =16 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1 0 200m 50m 100m 150m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =4.2v r l =32 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1 0 125m 25m 50m 75m 100m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =3.6v r l =32 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1 0 75m 15m 30m 45m 60m t h d + n ( % ) output power (mw) thd+n vs. output power f in =20khz v dd =2.8v r l =16 w c in =1 m f bw<80khz stereo, in phase f in =20hz f in =1khz 0.01 10 0.1 1
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =4.2v r l =16 w c in =1 m f bw<80khz p o =55mw p o =30mw p o =10mw 0.006 1 0.01 0.1 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =3.6v r l =16 w c in =1 m f bw<80khz p o =40mw p o =20mw p o =10mw 0.006 1 0.01 0.1 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =2.8v r l =16 w c in =1 m f bw<80khz p o =20mw p o =10mw 0.006 1 0.01 0.1 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =3.6v r l =32 w c in =1 m f bw<80khz p o =40mw p o =20mw p o =10mw 0.006 1 0.01 0.1 0 4 1 2 3 t h d + n ( % ) output voltage (v rms ) thd+n vs. output voltage v dd =2.8v f in =1khz r l =10k w c in =1 m f bw<80khz stereo, in phase v dd =4.2v v dd =3.6v 0.01 10 0.1 1 thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =4.2v r l =32 w c in =1 m f bw<80khz p o =60mw p o =30mw p o =10mw 0.006 1 0.01 0.1 10 20k 100 1k 10k
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 8 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =4.2v r l =10k w c in =1 m f bw<80khz v o =2v rms v o =1v rms v o =0.1v rms 0.006 1 0.01 0.1 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =2.8v r l =10k w c in =1 m f bw<80khz v o =1.4v rms v o =0.7v rms v o =0.1v rms 0.006 1 0.01 0.1 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =3.6v r l =10k w c in =1 m f bw<80khz v o =1.6v rms v o =0.8v rms v o =0.1v rms 0.006 1 0.01 0.1 10 20k 100 1k 10k crosstalk vs. frequency c r o s s t a l k ( d b ) frequency (hz) left to right right to left v dd =3.6v r l =32 w p o =40mw c in =1 m f -120 +0 -100 -80 -60 -40 -20 10 20k 100 1k 10k crosstalk vs. frequency c r o s s t a l k ( d b ) frequency (hz) left to right right to left v dd =3.6v r l =10k w v o =1.6v rms c in =1 m f -120 +0 -100 -80 -60 -40 -20 10 20k 100 1k 10k thd+n vs. frequency frequency (hz) t h d + n ( % ) v dd =2.8v r l =32 w c in =1 m f bw<80khz p o =20mw p o =10mw 0.006 1 0.01 0.1
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 9 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) 10 200k 100 1k 10k frequency response frequency (hz) g a i n ( d b ) p h a s e ( d e g ) gain phase v dd =3.6v r l =32 w p o =40mw c in =1 m f +0 +4 +1 +2 +3 +140 +220 +160 +180 +200 10 200k 100 1k 10k frequency response frequency (hz) g a i n ( d b ) p h a s e ( d e g ) gain phase v dd =3.6v r l =10k w v o =1.6v rms c in =1 m f +0 +4 +1 +2 +3 +140 +220 +160 +180 +200 10 20k 100 1k 10k psrr vs. frequency frequency (hz) p s r r ( d b ) v dd =3.6v r l =10k w c in =1 m f v rr =100mv rms left channel right channel -100 -30 -90 -80 -70 -60 -50 -40 10 20k 100 1k 10k t psrr vs. frequency frequency (hz) p s r r ( d b ) v dd =3.6v r l =32 w c in =1 m f v rr =100mv rms left channel right channel -100 -30 -90 -80 -70 -60 -50 -40 -120 +0 -80 -40 -120 -80 -40 0 2k 400 800 1.2k 1.6k +0 gsm power supply rejection vs. frequency s u p p l y v o l t a g e ( d b v ) frequency (hz) o u t p u t v o l t a g e ( d b v ) 10 20k 100 1k 10k o u t p u t n o i s e v o l t a g e ( v r m s ) frequency (hz) v dd =3.6v c in =1 m f a-wighting output noise voltage vs. frequency r l =16 w r l =10k w 10 m 50 m 15 m 20 m 25 m 30 m 35 m 40 m 45 m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 0 o p e r a t i n g w a v e f o r m s s h u t d o w n r e l e a s e ch1: v sdn , 2v/div, dc time:2m s/div ch2: v rout , 1v/div, dc v dd =3.6v, r l =32 w s h u t d o w n ch1: v rsd , 2v/div, dc time:2m s/div ch2: v rout , 1v/div, dc v dd =3.6v, r l =32 w o u t p u t t r a n s i e n t a t s h u t d o w n r e l e a s e v sdn 2 v rout 1 2 3 1 v sdn v rout v lout o u t p u t t r a n s i e n t a t s h u t d o w n 2 3 1 v sdn v rout v lout 2 1 v sdn v rout ch1: v sdn , 2v/div, dc time:2m s/div ch2: v l out , 20mv/div, dc ch3: v r out , 20mv/div, dc v dd =3.6v, r l =32 w ch1: v sdn , 2v/div, dc time:2m s/div ch2: v lout , 20mv/div, dc ch3: v rout , 20mv/div, dc v dd =3.6v, r l =32 w
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 1 o p e r a t i n g w a v e f o r m s ( c o n t . ) g s m p o w e r s u p p l y r e j e c t i o n v s . t i m e 2 3 1 v lout v dd v rout ch1: v dd , 200mv/div, dc, offset=3.6v time:2m s/div ch2: v lout , 20mv/div, dc ch3: v rout , 20mv/div, dc v dd =3.6v, r l =32 w pin no. wlcsp 1.6x1.6 - 12 tdfn3x3 - 12 name i/o/p function a1 11 cvss o charge pump output, connect to the ?vss? . a2 10 cpn i/o charge pump flying capacitor negative connection . a3 9 pgnd p charge pump? s ground . a4 8 cpp i/o charge pump flying capa citor positive connection . b1 12 vss p headphone driver negative power supply . b2 3 sdn i shutdown mod control input signal, pull low for shutdown headphone driver. b3 7 gnd p ground connection for circuitry. b4 6 vdd p supply voltage input pin. c1 1 lout o left channel output for headphone. c2 2 rout o right channel output for headphone. c3 4 lin i left channel input terminal . c4 5 rin i right channel input terminal . p i n d e s c r i p t i o n
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 2 b l o c k d i a g r a m shutdown circuit power and depop circuit rout rin sdn charge pump lin lout gnd vdd cpp cpn cvss vss pgnd t y p i c a l a p p l i c a t i o n c i r c u i t 1 m f shutdown control v dd v ss 1 m f (x5r) shutdown power and depop circuit rout rin sdn charge pump lin lout gnd vdd cpp cpn cvss vss pgnd 1 m f 1 m f rout lout audio dac c cpf c cpo c s c i1 c i2 stereo headphone 1 m f circuit
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 3 headphone driver operation f u n c t i o n d e s c r i p t i o n t h e a p a 2 1 8 0 ? s h e a d p h o n e d r i v e r s u s e a c h a r g e p u m p t o i n v e r t t h e p o s i t i v e p o w e r s u p p l y ( v d d ) t o n e g a t i v e p o w e r s u p p l y ( v s s ) , s e e f i g u r e 1 . t h e h e a d p h o n e d r i v e r s o p e r - a t e a t t h i s b i p o l a r p o w e r s u p p l y ( v d d a n d v s s ) a n d t h e o u t - p u t s r e f e r e n c e r e f e r s t o t h e g r o u n d . t h i s f e a t u r e e l i m i - n a t e s t h e o u t p u t c a p a c i t o r t h a t i s u s i n g i n c o n v e n t i o n a l s i n g l e - e n d e d h e a d p h o n e d r i v e a m p l i f i e r . c o m p a r e w i t h t h e s i n g l e p o w e r s u p p l y a m p l i f i e r , t h e p o w e r s u p p l y r a n g e h a s a l m o s t d o u b l e d . f i g u r e 1 . c a p - f r e e o p e r a t i o n thermal protection t h e t h e r m a l p r o t e c t i o n c i r c u i t l i m i t s t h e j u n c t i o n t e m p e r a - t u r e o f t h e a p a 2 1 8 0 . w h e n t h e j u n c t i o n t e m p e r a t u r e e x - c e e d s t j = + 1 5 0 o c , a t h e r m a l s e n s o r t u r n s o f f t h e d r i v e r , a l l o w i n g t h e d e v i c e s t o c o o l . t h e t h e r m a l s e n s o r a l l o w s t h e d r i v e r t o s t a r t - u p a f t e r t h e j u n c t i o n t e m p e r a t u r e d o w n a b o u t 1 2 5 o c . t h e t h e r m a l p r o t e c t i o n i s d e s i g n e d w i t h a 2 5 o c h y s t e r e s i s t o l o w e r t h e a v e r a g e t j d u r i n g c o n t i n u - o u s t h e r m a l o v e r l o a d c o n d i t i o n s , i n c r e a s i n g l i f e t i m e o f t h e i c s . shutdown function i n o r d e r t o r e d u c e p o w e r c o n s u m p t i o n w h i l e n o t i n u s e , t h e a p a 2 1 8 0 c o n t a i n s s h u t d o w n c o n t r o l l e r s t o e x t e r n a l l y t u r n o f f t h e a m p l i f i e r b i a s c i r c u i t r y . t h i s s h u t d o w n f e a t u r e t u r n s t h e a m p l i f i e r o f f w h e n l o g i c l o w i s p l a c e d o n t h e s d n p i n s f o r t h e a p a 2 1 8 0 . t h e t r i g g e r p o i n t b e t w e e n a l o g i c h i g h l e v e l i s 1 . 0 v a n d l o g i c l o w l e v e l i s 0 . 3 5 v . i t i s r e c o m m e n d e d t o s w i t c h b e t w e e n t h e g r o u n d a n d t h e s u p - p l y v o l t a g e v d d t o p r o v i d e m a x i m u m d e v i c e p e r f o r m a n c e . b y s w i t c h i n g t h e s d n p i n s t o a l o w l e v e l , t h e a m p l i f i e r e n t e r s a l o w - c o n s u m p t i o n c u r r e n t c i r c u m s t a n c e , c h a r g e p u m p i s d i s a b l e d , a n d i d d f o r t h e a p a 2 1 8 0 i s i n s h u t d o w n m o d e . i n n o r m a l o p e r a t i n g , t h e a p a 2 1 8 0 ? s s d n p i n s s h o u l d b e p u l l e d t o a h i g h l e v e l t o k e e p t h e i c o u t o f t h e s h u t d o w n m o d e . t h e s d n p i n s s h o u l d b e t i e d t o a d e f i - n i t e v o l t a g e t o a v o i d u n w a n t e d c i r c u m s t a n c e c h a n g e s . v dd v dd /2 gnd v out v dd v ss gnd v out conventional headphone driver cap-free headphone driver
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 4 a p p l i c a t i o n i n f o r m a t i o n charge pump flying capacitor (c cpf ) t h e f l y i n g c a p a c i t o r ( c c p f ) a f f e c t s t h e l o a d t r a n s i e n t o f t h e c h a r g e p u m p . i f t h e c a p a c i t o r ? s v a l u e i s t o o s m a l l , a n d t h e n t h i s i n c r e a s e s c h a r g e p u m p ? s o u t p u t r e s i s t a n c e a n d d e g r a d e s t h e p e r f o r m a n c e o f h e a d p h o n e a m p l i f i e r . i n c r e a s i n g t h e f l y i n g c a p a c i t o r ? s v a l u e i m p r o v e s t h e l o a d t r a n s i e n t o f c h a r g e p u m p . i t i s r e c o m m e n d t o u s e t h e l o w e s r c e r a m i c c a p a c i t o r s ( x 5 r o r x 7 r t y p e i s r e c o m m e n d e d ) a b o v e 1 m f . charge pump output capacitor (c cpo ) the charge pump needs an output capacitor(c cpo ) to fil- ter the negative output current pulse flowing into cvss pin as well as reduces the output voltage ripple(cvss). the capacitor also sucks in surge current flowing from the v ss pin, the negative power input pin for the amplifiers. the output ripple is determined by the capacitance, esr, and current ripple of the output capacitor. increasing the value of output capacitor and decreasing the esr can reduce the voltage ripple. using a low-esr ceramic ca- pacitor greater than 1 m f is recommended. for reducing the parasitic inductance and improving the noise decoupling, place the capacitor near the cvss and pgnd pins as close as possible. i n p u t c a p a c i t o r ( c i ) i n t h e t y p i c a l a p p l i c a t i o n , a n i n p u t c a p a c i t o r ( c i ) i s r e q u i r e d t o a l l o w t h e a m p l i f i e r t o b i a s t h e i n p u t s i g n a l t o t h e p r o p e r d c l e v e l f o r o p t i m u m o p e r a t i o n . i n t h i s c a s e , c i a n d t h e i n p u t i m p e d a n c e r i f r o m a h i g h - p a s s f i l t e r w i t h t h e c u t o f f f r e q u e n c y a r e d e t e r m i n e d i n t h e f o l l o w i n g e q u a t i o n : t h e v a l u e o f c i m u s t b e c o n s i d e r e d c a r e f u l l y b e c a u s e i t d i r e c t l y a f f e c t s t h e l o w f r e q u e n c y p e r f o r m a n c e o f t h e c i r c u i t . c o n s i d e r t h e e x a m p l e w h e r e r i i s 1 4 k w a n d t h e s p e c i f i - c a t i o n t h a t c a l l s f o r a f l a t b a s s r e s p o n s e d o w n t o 1 0 h z . t h e e q u a t i o n i s r e c o n f i g u r e d a s b e l o w : w h e n i n p u t r e s i s t a n c e v a r i a t i o n i s c o n s i d e r e d , t h e c i i s 1 m f . t h e r e f o r e , a v a l u e i n t h e r a n g e o f 1 m f t o 2 . 2 m f w o u l d b e c h o s e n . a f u r t h e r c o n s i d e r a t i o n f o r t h i s c a p a c i t o r i s t h e l e a k a g e p a t h f r o m t h e i n p u t s o u r c e t h r o u g h t h e i n p u t n e t - w o r k ( r i + r f , c i ) t o t h e l o a d . t h i s l e a k a g e c u r r e n t c r e a t e s a d c o f f s e t v o l t a g e a t t h e i n p u t t o t h e a m p l i f i e r t h a t r e d u c e s u s e f u l h e a d r o o m , e s - p e c i a l l y i n h i g h g a i n a p p l i c a t i o n s . f o r t h i s r e a s o n , a l o w - l e a k a g e t a n t a l u m o r c e r a m i c c a p a c i t o r i s t h e b e s t c h o i c e . w h e n p o l a r i z e d c a p a c i t o r s a r e u s e d , t h e n e g a t i v e s i d e o f t h e c a p a c i t o r s h o u l d f a c e t h e a m p l i f i e r s ? i n p u t s i n m o s t a p p l i c a t i o n s b e c a u s e t h e d c l e v e l o f t h e a m p l i f i e r s ? i n - p u t s a r e h e l d a t 0 v . p l e a s e n o t e t h a t i t i s i m p o r t a n t t o c o n f i r m t h e c a p a c i t o r p o l a r i t y i n t h e a p p l i c a t i o n . p o w e r s u p p l y d e c o u p l i n g ( c s ) t h e a p a 2 1 8 0 i s a h i g h - p e r f o r m a n c e c m o s a u d i o a m p l i - f i e r t h a t r e q u i r e s a d e q u a t e p o w e r s u p p l y d e c o u p l i n g t o e n s u r e t h e o u t p u t t o t a l h a r m o n i c d i s t o r t i o n ( t h d + n ) a s l o w a s p o s s i b l e . p o w e r s u p p l y d e c o u p l i n g a l s o p r e v e n t s t h e o s c i l l a t i o n s b e i n g c a u s e d b y l o n g l e a d l e n g t h b e - t w e e n t h e a m p l i f i e r a n d t h e s p e a k e r . t h e o p t i m u m d e c o u p l i n g i s a c h i e v e d b y u s i n g t w o d i f f e r - e n t t y p e s o f c a p a c i t o r t h a t t a r g e t o n d i f f e r e n t t y p e s o f n o i s e o n t h e p o w e r s u p p l y l e a d s . f o r h i g h e r f r e q u e n c y t r a n s i e n t s , s p i k e s , o r d i g i t a l h a s h o n t h e l i n e , a g o o d l o w e q u i v a l e n t - s e r i e s - r e s i s t a n c e ( e s r ) c e r a m i c c a p a c i t o r , t y p i c a l l y 0 . 1 m f , i s p l a c e d a s c l o s e a s p o s s i b l e t o t h e d e - v i c e v d d l e a d f o r t h e b e s t p e r f o r m a n c e . f o r f i l t e r i n g l o w e r f r e q u e n c y n o i s e s i g n a l s , a l a r g e a l u m i n u m e l e c t r o l y t i c c a p a c i t o r o f 1 0 m f o r g r e a t e r p l a c e d n e a r t h e a u d i o p o w e r a m p l i f i e r i s r e c o m m e n d e d . thermal consideration (1) (2) c i i f r 2 1 c p = i i ) c(highpass c r 2 1 f p = linear power amplifiers dissipate a significant amount of heat in the package in normal operating condition. the first consideration to calculate maximum ambient tem peratures is the numbers from the power dissipation vs. output power graphs are per channel values, so the dis- sipation of the ic heat needs to be doubled for two-chan- nel operation. given q ja , the maximum allowable junc- tion temperature (t jmax ), the total internal dissipation (p d ), and the maximum ambient temperature can be calcu-
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 5 a p p l i c a t i o n i n f o r m a t i o n ( c o n t . ) thermal consideration (cont.) layout consideration 1. all components should be placed close to the a p a 2 1 8 0 . for example, the input capacitor (c ir , c il ) should be close to a p a 2 1 8 0 input pins to avoid causing noise coupling to a p a 2 1 8 0 high impedance inputs; the decoupling capacitor (c s ) should be placed by the a p a 2 1 8 0 power pin to decouple the power rail noise. 2. the output traces should be short, wide (>50mil), and symmetric. 3. the input trace should be short and symmetric. 4. the power trace width should be greater than 50mil. 5. t h e i n p u t t r a c e a n d o u t p u t t r a c e s h o u l d b e a w a y f r o m c c p f a n d c c p b p o s s i b l e . 0.4mm 0.4mm 12 x f 0.20mm figure 2. wlcsp2x2-16 land pattern recommendation lated with the following equation. the maximum recom- mended junction temperature for the a p a 2 1 8 0 is 150 o c. the internal dissipation figures are taken from the power dissipation vs. output power graphs. the a p a 2 1 8 0 is designed with a thermal shutdown protection that turns the device off when the junction temperature surpasses 150c to prevent damaging the ic. figure 3. wlcsp2x2-16 layout suggestion pin a1 c i2 c cpb o u t p u t t r a c e o u t p u t t r a c e c i1 c cpf figure 4 : tdfn 3 x 3 - 12 layout recommendation 0 . 45 mm 0 . 3 mm ground plane for thermalpad thermalvia diameter 0 . 3 mm x 5 2 . 7 m m 0 . 5 mm 1 . 75 mm
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 6 p a c k a g e i n f o r m a t i o n w l c s p 1 . 6 x 1 . 6 - 1 2 s y m b o l min. max. 0.55 0.10 0.15 0.25 1.50 1.60 0.20 a a1 b d e e millimeters a2 0.55 0.75 0.4 bsc wlcsp1.6x1.6-12 0.016 bsc min. max. inches 0.022 0.004 0.022 0.030 0.006 0.010 0.059 0.063 0.008 0.45 0.017 1.50 1.60 0.059 0.063 b e/2 e e a a2 a1 pin 1 d e
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 7 p a c k a g e i n f o r m a t i o n tdfn3x3-12 s y m b o l min. max. 0.80 0.00 0.18 0.30 2.20 2.70 0.05 1.40 a a1 b d d2 e e2 e l millimeters a3 0.20 ref tdfn3x3-12 0.30 0.50 1.75 0.008 ref min. max. inches 0.000 0.007 0.012 0.087 0.106 0.055 0.012 0.020 0.70 0.069 0.028 0.002 0.45 bsc 0.018 bsc 0.20 0.008 k 2.90 3.10 0.114 0.122 2.90 3.10 0.114 0.122 e l k e 2 pin 1 corner d2 a a1 a3 b pin 1 e d 0.031
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 8 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 wlcsp1.6x1.6 - 12 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 1.75 ? 0.15 1.75 ? 0.15 0.75 ? 0.10 application a h t1 c d d w e1 f 330 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 t dfn 3x3 - 1 2 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1. 5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 3.30 ? 0.20 3.30 ? 0.20 1.30 ? 0.20 (mm) c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 1 9 t a p i n g d i r e c t i o n i n f o r m a t i o n w l c s p 1 . 6 x 1 . 6 - 1 2 user direction of feed package type unit quantity wlcsp1.6x1.6 - 12 tape & reel 3000 tdfn3x3 - 12 tape & reel 3000 d e v i c e s p e r u n i t tdfn3x3-12 user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 2 0 c l a s s i f i c a t i o n p r o f i l e
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 2 1 profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n r e f l o w p r o f i l e s table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c r e l i a b i l i t y t e s t p r o g r a m test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ t j =125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 3 - d e c . , 2 0 1 2 a p a 2 1 8 0 w w w . a n p e c . c o m . t w 2 2 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8

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